? semiconductor components industries, llc, 2016 april, 2016 ? rev. 12 1 publication order number: bcp56t1/d bcp56 series npn silicon epitaxial transistor these npn silicon epitaxial transistors are designed for use in audio amplifier applications. the device is housed in the sot?223 package, which is designed for medium power surface mount applications. features ? high current: 1.0 a ? the sot?223 package can be soldered using wave or reflow. the formed leads absorb thermal stress during soldering, eliminating the possibility of damage to the die ? available in 12 mm tape and reel use bcp56t1g to order the 7 inch/1000 unit reel use bcp56t3g to order the 13 inch/4000 unit reel ? pnp complement is bcp53t1g ? s and nsv prefix for automotive and other applications requiring unique site and control change requirements; aec?q101 qualified and ppap capable ? these devices are pb?free, halogen free/bfr free and are rohs compliant maximum ratings (t c = 25 c unless otherwise noted) rating symbol value unit collector?emitter voltage v ceo 80 vdc collector?base voltage v cbo 100 vdc emitter?base voltage v ebo 5 vdc collector current i c 1 adc total power dissipation @ t a = 25 c (note 1) derate above 25 c p d 1.5 12 w mw/ c operating and storage temperature range t j , t stg ?65 to 150 c thermal characteristics characteristic symbol max unit thermal resistance, junction?to?ambient (surface mounted) r ja 83.3 c/w maximum temperature for soldering purposes time in solder bath t l 260 10 c sec stresses exceeding those listed in the maximum ratings table may damage the device. if any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. device mounted on a fr?4 glass e poxy printed circuit board 1.575 in x 1.575 in x 0.0625 in; mounting pad for the collector lead = 0.93 sq in. sot?223 case 318e style 1 marking diagram collector 2,4 base 1 emitter 3 medium power npn silicon high current transistor surface mount 1 2 3 4 www. onsemi.com see detailed ordering, marking and shipping information in the package dimensions section on page 2 of this data sheet. ordering information 1 ayw xxxxx xxxxx = specific device code a = assembly location y = year w = work week = pb?free package (note: microdot may be in either location)
bcp56 series www. onsemi.com 2 electrical characteristics (t a = 25 c unless otherwise noted) characteristics symbol min typ max unit off characteristics collector?base breakdown voltage (i c = 100 adc, i e = 0) v (br)cbo 100 ? ? vdc collector?emitter breakdown voltage (i c = 1.0 madc, i b = 0) v (br)ceo 80 ? ? vdc emitter?base breakdown voltage (i e = 10 adc, i c = 0) v (br)ebo 5.0 ? ? vdc collector?base cutoff current (v cb = 30 vdc, i e = 0) i cbo ? ? 100 nadc emitter?base cutoff current (v eb = 5.0 vdc, i c = 0) i ebo ? ? 10 adc on characteristics (note 2) dc current gain (i c = 5.0 ma, v ce = 2.0 v) all part types (i c = 150 ma, v ce = 2.0 v) bcp56 bcp56?10 bcp56?16 (i c = 500 ma, v ce = 2.0 v) all types h fe 25 40 63 100 25 ? ? ? ? ? ? 250 160 250 ? ? collector?emitter saturation voltage (i c = 500 madc, i b = 50 madc) v ce(sat) ? ? 0.5 vdc base?emitter on voltage (i c = 500 madc, v ce = 2.0 vdc) v be(on) ? ? 1.0 vdc dynamic characteristics current?gain ? bandwidth product (i c = 10 madc, v ce = 5.0 vdc, f = 35 mhz) f t ? 130 ? mhz product parametric performance is indicated in the electrical characteristics for the listed test conditions, unless otherwise noted. product performance may not be indicated by the electrical characteristics if operated under different conditions. 2. pulse test: pulse width 300 s, duty cycle 2.0% ordering information device marking package shipping ? bcp56t1g bh sot?223 (pb?free) 1000 / tape & reel sbcp56t1g* bcp56t3g bh sot?223 (pb?free) 4000 / tape & reel sbcp56t3g* bcp56?10t1g bh?10 sot?223 (pb?free) 1000 / tape & reel sbcp56?10t1g* bcp56?10t3g bh?10 sot?223 (pb?free) 4000 / tape & reel nsvbcp56?10t3g* bcp56?16t1g bh?16 sot?223 (pb?free) 1000 / tape & reel sbcp56?16t1g* bcp56?16t3g bh?16 sot?223 (pb?free) 4000 / tape & reel sbcp56?16t3g* ?for information on tape and reel specifications, including part orientation and tape sizes, please refer to our tape and reel packaging specifications brochure, brd8011/d. *s and nsv prefix for automotive and other applications requiring unique site and control change requirements; aec?q101 qualifi ed and ppap capable.
bcp56 series www. onsemi.com 3 typical electrical characteristics h fe , dc current gain 100 10 1000 100 10 0.1 i c , collector current (ma) figure 1. dc current gain i c , collector current (ma) figure 2. current?gain ? bandwidth product f, current\gain bandwidth product (mhz) t 1000 100 10 100 10 1.0 1000 c, capacitance (pf) 80 60 40 20 10 8.0 6.0 4.0 v r , reverse voltage (volts) figure 3. capacitance 0.1 0.2 0.5 1.0 2.0 5.0 10 20 50 100 figure 4. collector emitter saturation voltage vs. collector current figure 5. base emitter saturation voltage vs. collector current t a = 150 c 25 c -55 c t j = 25 c c ibo c obo 1000 i c , collector current (a) i c , collector current (a) 1 0.1 0.01 0.001 0.01 0.1 1 1 0.1 0.01 0.001 0.2 0.3 0.4 0.6 0.8 0.9 1.1 1.2 v ce(sat) , collector?emitter saturation voltage (v) v be(sat) , base?emitter saturation voltage (v) i c /i b = 10 150 c 25 c ?55 c 0.5 0.7 1.0 i c /i b = 10 150 c 25 c ?55 c 1 v ce = 2 v 125 c - 6 5 c
bcp56 series www. onsemi.com 4 typical electrical characteristics 1.0 0.8 0.6 0.4 0.2 0 i b , base current (ma) 0.05 0.1 0.2 0.5 2.0 5.0 10 20 50 v ce , collector\emitter voltage (volts) 1.0 50 ma 100ma t j = 25 c 250ma 500ma i c = 10ma figure 6. base emitter voltage vs. collector current i c , collector current (a) 1 0.1 0.01 0.001 0.2 0.3 0.4 0.6 0.8 0.9 1.1 1.2 v be(on) , base?emitter voltage (v) 0.5 0.7 1.0 v ce = 2 v 150 c 25 c ?55 c figure 7. collector saturation region t a , ambient temperature ( c) figure 8. safe operating area 1.6 0.8 0.0 100 20 016 0 p d , power dissipation (w) 120 40 140 60 80 1.0 0.2 1.2 0.4 1.4 0.6 figure 9. power derating curve v ce , collector emitter voltage (v) 100 10 1 0.1 0.01 1 i c , collector current (a) 0.1 100 ms 10 ms 1 ms 1 s
bcp56 series www. onsemi.com 5 package dimensions sot?223 (to?261) case 318e?04 issue n style 1: pin 1. base 2. collector 3. emitter 4. collector a1 b1 d e b e e1 4 123 0.08 (0003) a l1 c notes: 1. dimensioning and tolerancing per asme y14.5m, 1994. 2. controlling dimension: inch. 1.5 0.059 mm inches scale 6:1 3.8 0.15 2.0 0.079 6.3 0.248 2.3 0.091 2.3 0.091 2.0 0.079 soldering footprint* h e dim a min nom max min millimeters 1.50 1.63 1.75 0.060 inches a1 0.02 0.06 0.10 0.001 b 0.60 0.75 0.89 0.024 b1 2.90 3.06 3.20 0.115 c 0.24 0.29 0.35 0.009 d 6.30 6.50 6.70 0.249 e 3.30 3.50 3.70 0.130 e 2.20 2.30 2.40 0.087 0.85 0.94 1.05 0.033 0.064 0.068 0.002 0.004 0.030 0.035 0.121 0.126 0.012 0.014 0.256 0.263 0.138 0.145 0.091 0.094 0.037 0.041 nom max l1 1.50 1.75 2.00 0.060 6.70 7.00 7.30 0.264 0.069 0.078 0.276 0.287 h e ? ? e1 0 1 0 0 1 0 l l 0.20 ??? ??? 0.008 ??? ??? *for additional information on our pb?free strategy and soldering details, please download the on semiconductor soldering and mounting techniques reference manual, solderrm/d. on semiconductor and the are registered trademarks of semiconductor components industries, llc (scillc) or its subsidia ries in the united states and/or other countries. scillc owns the rights to a number of pa tents, trademarks, copyrights, trade secret s, and other intellectual property. a listin g of scillc?s product/patent coverage may be accessed at www.onsemi.com/site/pdf/patent?marking.pdf. scillc reserves the right to make changes without further notice to any product s herein. scillc makes no warranty, representation or guarantee regarding the suitability of its products for any part icular purpose, nor does sci llc assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. ?typi cal? parameters which may be provided in scillc data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. all operating param eters, including ?typicals? must be validated for each customer application by customer?s technical experts. scillc does not convey any license under its patent rights nor the right s of others. scillc products are not designed, intended, or authorized for use as components in systems intended for surgic al implant into the body, or other applications intended to s upport or sustain life, or for any other application in which the failure of the scillc product could create a situation where personal injury or death may occur. should buyer purchase or use scillc products for any such unintended or unauthorized application, buyer s hall indemnify and hold scillc and its officers , employees, subsidiaries, affiliates, and dist ributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that scillc was negligent regarding the design or manufac ture of the part. scillc is an equal opportunity/affirmative action employer. this literature is subject to all applicable copyright laws and is not for resale in any manner. p ublication ordering information n. american technical support : 800?282?9855 toll free usa/canada europe, middle east and africa technical support: phone: 421 33 790 2910 japan customer focus center phone: 81?3?5817?1050 bcp56t1/d literature fulfillment : literature distribution center for on semiconductor 19521 e. 32nd pkwy, aurora, colorado 80011 usa phone : 303?675?2175 or 800?344?3860 toll free usa/canada fax : 303?675?2176 or 800?344?3867 toll free usa/canada email : orderlit@onsemi.com on semiconductor website : www.onsemi.com order literature : http://www.onsemi.com/orderlit for additional information, please contact your loc al sales representative
|
